The Transparent Reference Fab: A scalable, open blueprint for European semiconductor sovereignty
- Speaker(s): Herfurth, Norbert, Arnd Weber and Steffen Reith
- email: herfurth@ihp-microelectronics.com
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Abstract
The European Chips Act aims to double Europe’s share in global semiconductor manufacturing to 20% by 2030. However, most current investments focus on leading-edge nodes and pilot lines, which – while important – are not sufficient to achieve broad capacity scaling. At the same time, demand for mature nodes (≥65 nm) remains strong: over two-thirds of chips in automotive and industrial sectors still rely on nodes ≥90 nm, and this trend is expected to persist through 2030. This contribution introduces the concept of a Transparent Reference Fab – a fully open, scalable semiconductor fabrication model designed to serve as a blueprint for sovereign and trustworthy chip manufacturing in Europe. Unlike traditional pilot lines, the Transparent Reference Fab is production-ready and replicable. It includes open access to process design kits (PDKs), equipment configurations, process recipes, and operational know-how. The fab targets mature nodes, especially 65 nm CMOS, and is intended to be built on existing infrastructure to reduce time-to-market and technical risk. We argue that such a model can significantly multiply Europe’s production capacity by enabling private and public actors to replicate the reference fab across regions. This approach would not only strengthen Europe’s position in strategic semiconductor supply chains but also foster innovation, education, and security through transparency. The paper presents the strategic rationale, technical architecture, and implementation path, positioning the Transparent Reference Fab as a critical instrument for European resilience and competitiveness.