FSiC2026
| Free Silicon Conference 2026 | |
|---|---|
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| Genre | Free software and free hardware development conference |
| Location(s) | University of Ljubljana, Faculty of Electrical Engineering |
| Country | Slovenia |
| Website | wiki.f-si.org/index.php/FSiC2026 |
The 2026 Free Silicon Conference (FSiC) will take place at University of Ljubljana, Faculty of Electrical Engineering, on July 6 to 8 2026 (Monday to Wednesday). This event will build on previous FSiC editions. The conference will connect experts and enthusiasts who want to build a complete free and open-ource CAD ecosystem for designing analog and digital integrated circuits. The conference will cover the full spectrum of the design process, from system architecture to layout and verification.
Submission
This is your opportunity to present your project and to get in touch with the community. To propose a talk, please submit a title and a short summary at fsic2026 'at' f-si.org by March 1st 2026 (first submission phase). Topics are not restricted to the tentative program.
Participation
Information about registration will be published soon.
Tentative program
Digital design and logic-synthesis
Ongoing FOS silicon projects
Foundries, PDKs and standard-cell libraries
Analog flow, transistor modelling and circuit simulation
Hardware security
Economic sustainability and hardware licences
Policy, EU projects and funding opportunities
Back-end design tools
Teaching and education
Standards
Practical information
- Conference address:
Tržaška cesta 25 SI-1000 Ljubljana Slovenia
Organizing committee
Lead organizers (overall coordination and local host)
Programme co-organizers
Donations
We are looking for sponsors to cover extra services at the conference. In case of interest, please contact us at fsic2026'at'f-si.org.
Acknowledgements
This conference is co-funded by the Swiss State Secretariat for Education, Research and Innovation (SERI) under the NGI0 Commons Fund project. The NGI0 Commons Fund has received funding from the European Union’s Horizon Europe research and innovation programme under grant agreement No. 101135429.








